Current AI training models are datacentric and suffer from memory bottlenecks where the chip is idle waiting for data; high bandwidth memory (HBM) embedded in chip packages solves this, and the next generation of chips may be 10x faster through these techniques.
factualpending
Speaker
Eric SchmidtEvidence Quote
“High bandwidth memory embedded in chip packages could make next generation 10x faster.”
Source
AI and Quantum Computing: Glimpsing the Near Future | World Science Festival— World Science FestivalCreated: 8/12/2026, 10:28:01 PM
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